May 29 2026TECHNOLOGY
Future iPhone Camera Upgrade: 200MP and 8K Video in the Works
Apple’s next phone may ditch its current “Flip‑Chip” camera design for a new layout that keeps the sensor face up. This change, called Chip On Board (COB), lets the sensor sit on top of its board and connect via tiny wires instead of bumps. The result is better heat flow, tighter optical alignment,
reading time less than a minute
